Curamik CoolPerformance Plus liquid-cooled material dissipates large amounts of heat for thermal management of high-power laser diodes and other heat-generating optical devices. Features several layers of pure copper, taking advantage of its thermal conductivity, formed into hermetic, 3-D microchannel or macrochannel water-cooled structures capable dissipating large amounts of heat in small areas. Feature aluminum-nitride (AlN) isolation layers that separate cooling water channels from electrical contacts of laser diodes, and provide a close match in CTE (in the range of 5 to 7ppm/K) between the copper cooling structures and high-power ceramic laser diode packages for improved reliability even at high power levels.

Rogers Corp. PES rogerscorp.com/pes/index.aspx

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