New Products

Stackpole Electronics' RNCF series of precision thin film resistors is designed for markets such as medical instrumentation and control, industrial and automotive controls, communications, and test & measurement.

Read more ...

Mechnano's Tough ESD is an additive manufacturing (AM) resin based on its Mech T technology that utilizes the power of discrete Carbon Nanotubes(dCNTs).

Read more ...

Ventec's tec-speed 20.0 VTM1000i hydrocarbon laminate is designed for for antenna and communication systems, radar, and aviation systems, and is available in a range of dielectric thickness, with 0.38mm through to 3.81mm options, while offering a high decomposition temperature (Td) of 426°C.

Read more ...

Fujipoly America's CF210A thermal gap filler incorporates carbon fibers along with traditional fillers. Carbon fibers allow for higher thermal conductivity while remaining compliant. Compliance is closer to a much lower conductivity gap filler such as SARCON® PG25A. Has a stable thermal resistance, regardless of compression.

Read more ...

Vishay Intertechnology's seven new MOSFET and diode power modules are designed specifically for on-board charger applications.

Offer all the circuit configurations required for AC/DC, DC/DC, and DC/AC conversion in on-board charging applications — input / output bridges, full-bridge inverters, and power factor correction (PFC) — across a wide range of power ratings. Compliant with the AQG-324 automotive guideline and can be combined to provide a complete solution for electric (EV) and hybrid electric (HEV) vehicles, in addition to e-scooters, agricultural equipment, railways, and more.

EMIPAK package can accommodate a range of custom circuit configurations in the same 63mm x 34mm x 12mm footprint, enabling higher power density than utilizing discrete solutions while providing the flexibility to use each module in different power stages for industrial and renewable energy applications, including welding, plasma cutting, UPS, solar inverters, and wind turbines.

Exposed AI2O3 direct bonded copper (DBC) substrate provides improved thermal performance, while optimized layout helps to minimize stray inductance for better EMI performance. PressFit pin locking technology allows for easy PCB mounting and reduces mechanical stress on the substrate, while baseless structure increases reliability by reducing the number of solder interfaces.

Vishay Intertechnology

www.vishay.com

Kisters 3DViewStation supports Model Based Definition (MBD) processes – which means that all production-relevant product information is stored in the digital 3D model right from the start.

Supports use of annotated 3-D CAD models and visualizes annotations on the source file quickly and easily. Also supports the reading of PMI (Product Manufacturing Information) from numerous sources such as Catia, Creo, NX, JT, STEP as well as 2D PDFs with attached JT. Users can create their own 3D annotations or markups and save them again in 3DVS, JT, STEP (AP242), 3D-PDF, 2D-PDF. Different revision levels can be easily compared/ Own markups such as lines, texts or position number graphics can be added and these can be saved again as PMI in KISTERS' own format 3DVS or neutral formats such as STEP or JT. All capabilities of 3DViewStation can be used either independently or in conjunction with a leading system.

Comes in desktop, VR-Edition and HTML5 WebViewer versions plus the online collaboration tool VisShare. All product flavors are intended to be used together with a PLM, ERP or other management system product configuration or service and spare part applications, providing all necessary APIs. HTML5-based WebViewer solution available for cloud, portal and web solutions, which does not require client installation. All file formats can be used in combination with the intelligent navigation and hyperlinking features to address the needs of complex integration scenarios.

Kisters AG

kisters.de/en

Page 23 of 389