ModVIA plasma system is fully integrated and doubles its capacity from four to eight cells (eight to 16 panels) to accommodate manufacturing production growth. Compact design and small footprint. For treating printed circuit boards for desmear, etchback, and to provide surface activation. Accommodates a broad array of PCB panel technologies in various shapes and sizes including rigid, flexible, through-hole, and blind via, and works with a wide range of process gases such as Ar, O2, N2, and CF4. Nominally equipped with three electronic mass flow controllers (MFCs) for optimal control and delivery, the gas system can support a total of five MFCs. The temperature-controlled high flux electrode (HFE) design, custom control system, and advanced plasma cleaning technology are said to minimize CF4 usage and improve bonding performance. Chamber dimensions are 1652 (w) x 1747 (d) x 2445mm (h)(65 x 69 x 97"). Includes upgraded gas distribution and pump package, and improved user interface and control parameters. Chamber processes PCB panels in separate plasma cells to deliver high etch rates. Chassis houses plasma chamber (constructed of high-quality aluminum for superior durability), the control electronics, 40kHz RF generator, pump/blower package, and automatic matching network. Maintenance access available from either front or rear access panels. EH&S/Ergonomics compliant and CE marked.
Nordson March, nordson.com/en/divisions/march/products/plasma-treatment-systems/modvia-expandable-plasma-system