Printoganth MV TP1 electroless copper bath provides high throwing power into blind microvias, enabling ultra-fine lines and spaces of 10/10µm and below. Is said to be a drop-in solution and fully compatible with Atotech desmearing and activation processes for SAP technology. Throwing power values typically 100% on the capture pad and 70% in the wedges for 50/50µm and 60/40µm blind microvias on ABF GX-92 laminates. Deposits feature a favorable surface morphology for better dry film adhesion and etchability performance. Passed reliability tests such as TCT (Thermal Cycle Test), IST (Interconnect Stress Test), QVP (Quick Via Pull Test) and SST (Solder Shock Test). 

Atotech, .atotech.com/products/electronics/news-single-view/article/printoganth.html

• Prev
• Next