ELKTON, MD - W.L. Gore
introduced a new thermal interface material. The Gore Polarchip is a SF3000 silicone-free thermal interface material for use as a thermal gap pad. According to the company, the absence of silicone eliminates the problems of silicone outgassing and silicone oil migration.
The compressible, thermally conductive material is used for filling the undesirable air gaps between heat generating devices on the PCB and the heatsinks, heat spreaders and metal chassis that are used to dissipate the heat. The Polarchip thermal interface material is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene (ePTFE) matrix filled with boron nitride (BN) particles. The low elastic modulus of the ePTFE matrix imparts softness, conformability and compressibility to the composite, while the high thermal conductivity of the BN particles gives the composite its good thermal transport characteristics.
Polarchip thermal interface materials are produced in continuous rolls with a pressure sensitive adhesive on one side. It can be supplied in sheets or rolls of precision die-cut parts suitable for high volume assembly.