Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

Homepage Slideshow

  • What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19043-ultra-hdi-what-is-it-and-how-is-it-different-than-hdi

  • The Critical Nature of PCB Stackup

    The stackup supports every layer above it.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19042-the-critical-nature-of-pcb-stackup-and-how-to-build-an-efficient-one

  • The PCB Design Review Process

    A structured design review process ensures alignment.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19037-reviewing-the-pcb-design-review-process

  • Metal-Core PCBs and Thermal Management

    Catch heat at the board.

    https://pcdandf.com/pcdesign/index.php/current-issue/293-board-talk/19039-metal-core-pcbs-and-thermal-management

  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Products
  • CST Unveils CHT Solver

CST Unveils CHT Solver

Published: 24 May 2016
 by TEST ADMIN

Conjugate Heat Transfer (CHT) solver of CST Studio Suite offers thermal and airflow simulations for electromagnetic systems. Includes computational fluid dynamics. Simultaneously calculates heat transfer and fluid flow around components; can consider effects such as turbulence and thermal radiation. Allows results from electromagnetic simulations to be used as the basis for a thermal simulation.

CST, www.cst.com

CST CHTSolverweb

 

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
APRIL ISSUE
April cover

View the Digital
Edition Here!

POPULAR

  • Experimental Evaluation of High-Thermal Dielectric Materials and Surface-Mount Thermal Bridges in Multilayer PCB Designs
  • The Victory Plan Reborn: Forcing the Surge of America’s Drone Industrial Base
  • The Via Revolution: Stacked, Staggered and Copper-Filled
  • Adhesive vs. Adhesiveless Polyimide Core Materials Used in Flex and Rigid-Flex Applications
  • Hybrid vs. Single Material Stackup in PCB Design

Press Releases

  • SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
  • Wonderful PCB Launches Advanced PCB Reverse Engineering and Cloning Services to Accelerate Electronics Innovation
  • Umicore MDS successfully installs the Uyemura Thru-Cup® EVF-YF9 process at Hi-Tech Corporation – a strong signal for Europe's printed circuit board industry
  • ECIA Announces 2026 Executive Conference Core Committee Members
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy