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  • Ventec Says Polyimide Reliability Validated by HATS Testing

Ventec Says Polyimide Reliability Validated by HATS Testing

Published: 20 September 2016
 by Mike Buetow

SUZHOU – Ventec International today announced that the reliability of its polyimide laminates, prepregs and low-flow prepregs has been "conclusively demonstrated" by highly accelerated thermal stress (HATS) testing by two leading PCB manufacturers in Israel.

PCB Technologies tested Ventec's VT-901 materials in complex high-layer-count rigid multilayer constructions, while Eltek’s testing also included high-layer-count flex-rigid multilayers, Ventec said.

VT-901 "easily satisfied" the test criteria in all examples, the company added.

Ventec COO Europe and USA Mark Goodwin said the results "further demonstrate the thermal robustness of Ventec VT-901 polyimide and its suitability" for use in high-reliability multilayer applications.

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