LYON, FRANCE – The panel level packing (PLP) market is expected to reach $285 million in 2023, a 51% CAGR during the 2017-2023 period, according to Yole Développement.

PLP is a large-size panel format to meet the demand for lower cost, plus higher performance, says the research firm.

Two packaging technologies are considered PLP: FOPLP and embedded die. FOPLP attracts the greatest interest, says Yole, including equipment manufacturers and suppliers.