AUSTIN, TX – CSP packages, such as QFNs and stacked die CSPs, show an 8% CAGR from 2015 to 2020, according to TechSearch International, despite a slowing growth rate for smartphones.

Quad flat no-lead (QFN) packages are expected to have the strongest growth, with a CAGR of 8.6%. QFNs are found in a range of products, from automotive and industrial applications to mobile phones and wearable electronics.

Power devices continue to drive growth for copper clip versions of the QFN.