Embedded Capacitance Material (ECM) C2006 thin laminate material has a capacitance density of approximately 20 nF per sq. in. Reportedly can improve power integrity and reduce electromagnetic interference in small devices such as microphones, sensors, IC packaging and interposers. Helps achieve high-fidelity signals, high signal-to-noise ratio in radio frequencies, and higher speed digital signals in high-performance applications.

3M Electronic Solution Division – Interconnect, www.3Mconnectors.com

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