Microfill THF-100 electrolytic copper for through-hole fill of substrate core layers on IC substrate printed circuit boards (PCB). Is said to offer improved reliability and electrical and thermal conductivity over conventional via fill processes. Uses a DC process to achieve through-hole fill performance, and eliminates conductive paste, ink and solvents. Is said to provide copper to copper adhesion, reduced CTE mismatch within filled via structure. CVS can be applied for bath control.

Dow Chemical Co. www.dow.com


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