Aluminum clad laminate and catalyzed buildup film use catalyzed aluminum foil by Toyo that provides well-controlled surface texture and uniformly coated palladium metal.

Developed for outer and buildup layers, ACL and CBF enhance use of HDI PCB and package substrate manufacturing technology A-SAP. Allow for filling technical gap between mSAP HDI PCB and package substrates. A-SAP can be used for materials with thin electroless base copper layer. Liquid metal ink forms palladium catalyst, which allows for less than 10nm of uniform metal coating.


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