Quicksilver solder leveling system now includes patented tip design said to provide improved hole cleaning and surface uniformity.

Each model includes up-rated heating systems to accommodate higher temperatures used with Pb-free solder. Other features: environmental enclosure for improved fume and noise protection, efficient combines air knife/heat exchanger, preheat cycle facility for improved Pb-fee finishes, and a multi-speed pump for faster heat transfer to the panel and reducing solder oxidation during idling. Solder automatically flushed from sump surfaces before solidifying to eliminate Cu/Sn dendrite circulation.



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