MacuSpec VF-TH 200 is a DC electrolytic copper metallization process for simultaneous via filling and through-hole plating.

Can fill 3 x 3 to 5 x 3 mil vias in under 60 min. with a dimple of less than 10┬Ám. Reportedly eliminates the need for pre-dip and flash plating process steps.

MacDermid Enthone Electronics Solutions


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