Sarcon EGR-11F thermal interface material absorbs a range of unwanted electromagnetic energy.

Tacky, gel-like consistency makes it easy to handle and apply without requiring additional adhesive. Placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks. Provides shielding effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 1.0 W/m°K (ASTM D 2326) and thermal resistance of 1.05°Cin2/W at 14.5 psi. Comes in three sheet thicknesses (0.5, 1.0, 1.5mm) up to a maximum dimension of 300 x 200mm. Can be ordered in die-cut form to fit almost any application shape. Suitable for environments with operating temperatures that range from -30° to +120°C and exhibits a UL94 flame retardant rating of V-0.

Fujipoly America




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