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FEATURES

Design Planning
A Lean NPI Journey
A design bureau/EMS explains its implementation of Lean NPI, which relies on concurrent DfM analysis using vendor-supplied rule sets during PCB layout and improved data transfer.
by Randy Holt

Flex Circuits
Connecting Flex Layers Using Conductive Paste
A new flexible printed circuit method, called paste via, uses no copper plating and reduces board thickness by nearly 30%.
by Mike Buetow

FIRST PERSON

• Caveat Lector
  Open places.
  Mike Buetow

MONEY MATTERS

• ROI
  Talent over tools.
  Peter Bigelow

TECH TALK

• On the Forefront
  Next-gen packaging.
  E. Jan Vargerman

• Designer’s Notebook
  Overcoming impedance discontinuities.
  Charles Pfeil

• Flexperts
  Bonding stiffeners.
  Mark Finstad

• Technical Abstracts
  In case you missed it.