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FEATURES

PCB Layout
Will a Via Fit in Between?
BGAs have never been easy to route, but with 0.3mm versions coming, via-in-pad becomes a consideration.
by Duane Benson

Thermal Management
Cool Runnings
The ongoing push to integrate mechanical and electrical design has now extended to electronics cooling simulation.
by Mike Buetow

FIRST PERSON

• Caveat Lector
  Into Africa.
  Mike Buetow

MONEY MATTERS

• ROI
  Rigid-flex.
  Peter Bigelow

TECH TALK

• Designer’s Notebook
  Simulation accuracy.
  Patrick Carrier

• The Flexperts
  Sticky situations.
  Mark Verbrugge

• Tech Tips
  ‘Board’ talk.
  Robert Dervaes

• Technical Abstracts
  In case you missed it.