PCD&F September 2008 Cover


Environmental Update
Design for Green: Laminates
Taking the risk for a greener planet.
by Michael Taylor

Design Basics
A Systematic Approach to Increasing Layer Count
Increasing layer count requires an organized design approach to avoid re-spins and reduce time-to-market.
by John Peloso

PCB Fab Markets
The NTI $100 Million Club
The record shows long-term growth is best achieved by continued aggressive investments.
by Dr. Hayao Nakahara

Printable Nanocomposites
Advanced materials provide a low cost and highly versatile method for manufacturing flexible electronic circuits.
by Rabindra N. Das, How Lin, John M. Lauffer, Michael Rowlands, Norman Card and Voya R. Markovich


Our Line
The road to gold.
Kathy Nargi-Toth

Consistency and commitment are the true reflections of integrity.
Peter Bigelow

Positive Plating
Note: Part 1 ran in the May issue. Part 2 ran in the July issue. All three parts are included here.
Plating cell design can minimize the effects of primary current distribution, part 3.
Michael Carano

EMC for the Real World
At high frequencies the return current follows the path of least inductance, not the path of least resistance.
Dr. Bruce Archambeault

Final Finish Forum
Behind black pad: Process control is the only solution for consistent success.
George Milad

BGA Bulletin
Microvias reduce layer count when routing high pin count BGAs.
Charles Pfeil


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