MAGAZINE

With multiple assemblers involved in most projects, how can you speed up the development process?

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During the 1980s, high-density flexible circuit manufacturers ran around the barn a few times trying to decide the best way to produce a reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high density flexible circuits.

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Flexibility, preparation and passion are an effective combination.

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Stop thinking such traces must be a certain width!

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Mike Buetow

CAVEAT LECTOR

The next generation.

Mike Buetow
Peter Bigelow

ROI

Risk distribution.

Peter Bigelow
E. Jan Vardaman

ON THE FOREFRONT

ECTC recap: HDI is the future.

E. Jan Vardaman
Martin Cotton

MATERIAL GAINS

Multi-GHz system design.
Martin Cotton
Mark Finstad

THE FLEXPERTS

High-speed flex design.
Mark Finstad
David Bernard

TEST AND INSPECTION

Transmissive and reflective targets.

David Bernard, Ph.D.
Martin Wickham

DEFECTS DATABASE

Is it the mask, or is it the gold-plating underneath?
Martin Wickham