A record number of fabricators topped $100 million in sales in 2018. And after years of taking a backseat to mobile device fabs, multilayer manufacturers stand to reap the rewards. READ MORE...
Prototron Circuits: 2 Sites, 1 Vision
Sometimes two are better than one. In this case, it’s Prototron Circuits’ two West Coast-based quickturn plants. READ MORE...
The Paperless Factory
IPC-2581 can be augmented with stackup impedances, tolerances, designer/fabrication notes, dimensioning, v-scores, milling, panel/sub-panels, solder stencils, and so forth. A look at how IPC-2581 is used in assembly today and a few additional advantages of using the format to ensure a complete paperless solution READ MORE...
Is the PCB Industry Ready to Embrace 5G?
Growing demand for 5G systems escalates the need for high-end PCBs. Fabricators must be aware of smaller margins of error, risk of system malfunction and communication failures. READ MORE...
How to Produce an ECO or Update an Existing Design
Most CAD designers get the layout correct the first time and never make layout changes after board files go to production. So how do you handle large-scale modifications? READ MORE...
Material Selection for High-Speed PCB Design
When it comes to purchasing circuit boards, “commodity manager” may have been a reasonable title decades ago, but it’s not accurate today. Everything matters at higher speeds. READ MORE...
From the Archives: Some Smoothing on a Noisy Topic
How channel-to-channel crosstalk contributes to ISI and collapse of the eye. READ MORE...
5G Build-Out Will Speed PCB Fabricators’ Gains
A record number of fabricators topped $100 million in sales in 2018. And after years of taking a backseat to mobile device fabs, multilayer manufacturers stand to reap the rewards.
IPC-2581 can be augmented with stackup impedances, tolerances, designer/fabrication notes, dimensioning, v-scores, milling, panel/sub-panels, solder stencils, and so forth. A look at how IPC-2581 is used in assembly today and a few additional advantages of using the format to ensure a complete paperless solution
We are seeking papers for next year's PCB West technical conference.
The conference will be held Sept. 15 - 17 at the Santa Clara Convention Center. The September 2014 event attracted nearly 2,600 registrants and about 1,750 attendees for the actual event.
Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops; and half-day (3.5 hour) and full-day seminars.
Suggested paper and presentation topics include:
* RF and microwave design
* LED design and assembly
* High-speed, high-frequency design
* Signal integrity
* Component placement
* EMI/EMC analysis
* Thermal analysis and management
* HDI design
* PCB design/layout basics
* Component library creation and management
* Design for manufacture
* Packaging design
* Mixed-signal design
* Area arrays
* FPGA design and implementation
* Flex circuit design
* Design team collaboration
* PCB fabrication
* Flexible circuitry manufacturing
* Surface finishes
* Embedded passives and active devices
* Electronics assembly
* Soldering and materials
* Component placement
* Screen and stencil printing
* New component packaging
* Lead-free processes
* Environmental legislation (REACH, RoHS, etc.) and its effects
* Industry forecasts, and business and supply chain issues
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology.
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