VIENNA, AUSTRIA – AT&S has reinvented itself within the mobile device market, which accounts for nearly 64% of the company’s sales.
 
Going forward, AT&S will focus on the high-end segment of the market, where complex applications and demand for smaller devices necessitate the accelerated development of technologies to meet these needs.
 
Although a loss in market share, especially with customers in the low-cost segment, is expected, AT&S believes the move will strengthen its long-term position in the high-end segment. It will increase its focus on new technologies, such as rigid-flex solutions, production of finer structures and embedding components inside circuit boards. Investments are also planned.
 
Because of the company’s new strategic orientation and the unstable global economy, AT&S does not expect to see financial growth in its 2009/10 and 2010/11 fiscal years. Although, through focusing on its core competences, retaining its global presence and maintaining its technological orientation, the company foresees a beneficial positioning for future growth.
 

ELK GROVE VILLAGE, IL – Electronic Interconnect Technology (EI) has been UL certified for metal-clad PCBs with a standard dielectric and now offers a range of PCB thermal management materials.
 
The company can work with numerous thicknesses of aluminum and copper metal cores, providing precise machining tolerances and fabrication services for thermal management and long-term board reliability. EI also provides design counseling services, thermal analysis and feedback.
 
“The materials we use provide outstanding thermal performance with high dielectric strength and low capacitance,” said Pratish Patel, president and CEO. The carefully engineered constructions can eliminate the need for fans, heat spreaders and heat sinks, he explained.