AUSTIN, TX – Shipments of flip chip and wafer level packages (WLPs) continue to increase, says TechSearch International, based on its new report.

Emerging trends include fan-out WLPs and panel level packaging.

Flip chip has migrated from mainly high-performance devices found in supercomputers, servers, network systems, and PCs to the explosive growth in filters and RF devices found in today’s smartphones, says the research firm. In units, the CAGR from 2014 to 2019 is approximately 15%, while in number of wafers, the CAGR is 11%.

The industry is experiencing a transition from solder bump to Cu pillar, just as it moved from an evaporated bump to a plated process. Cu pillar adoption is set for a 29% CAGR from 2014 to 2019.

While the transition to copper pillar is underway, SnAg remains the Pb-free solution of choice, the firm says.

Increased demand for thinner, lighter-weight portable products continues to drive WLP growth. These packages offer a small footprint and a low-profile solution that enables ultrathin consumer products such as smartphones, tablets, and wearable electronics.

The CAGR for fan-in WLPs in units from 2014 to 2019 is almost 9%, while the CAGR in wafers is 10%.