BANNOCKBURN, IL – The IPC has released the International Technology Roadmap for Electronic Interconnections 2008-2009.

The roadmap is based on a two-year study that looks at future technology for the industry. The IPC Roadmap focuses exclusively on the printed board and electronics assembly industries, and centers on the manufacturing of substrates and assemblies.

The IPC roadmap uses product emulators to illustrate OEM needs. These product emulators have been developed with input from several OEMs and experts. Product emulators have been used in the IPC roadmap since 1995.

Product emulators for the 2008-2009 IPC roadmap are:

E1 - Electronic Games (portable).
E2 - Consumer Products (under $500).
E3 - Hand-held/Wireless Electronics.
E4 - Mid Range Performance Electronics.
E5 - High Performance Systems (mainframe/server/mass storage).
E6 - RF and Microwave Electronics (10 MHz).
E7 - Harsh Environments/Aerospace.
E8 - Harsh Environments/Auto Electronics.