HSINCHU, TAIWAN -- Powertech Technology Inc. has licensed IBM's MPS-C2 (Metal Post Solder-Chip Connection) technology, the company said today. No financial terms were disclosed.

MPS-C2 is a ultra fine pitch flip-chip package technology for chips with bond pad pitches of less than 80 microns.
It is useful in such applications as cell phones and other mobile applications where conventional wire-bond PoP, PiP or SiP packages might not work.

MPS-C2 is used to make bumps on pads with copper posts and SnAg solder. The bumps are formed on aluminum pads through a wafer plating process without redistribution. The bumps can then be connected to an organic substrate’s copper pads using conventional SMT reflow.

PTI is now the leading memory ODM package and testing house in the world.