LYON, FRANCE – The semiconductor industry grew 21.6% in 2017 to $412 billion, says Yole Développement.

In addition to mobile, the firm’s analysts identified emerging mega-drivers: big data, AI, 5G, HPC, IoT, smart automotive, industry 4.0, and data centers.

Yole predicts the advanced packaging market will grow at a 7% CAGR through 2023 to $39 billion.

“Advanced packaging is driven by the wind of changes, due to the impressive impact of the megatrends,” said Emilie Jolivet, division director, Semiconductor & Software at Yole. “Yole and NCAP China have decided to combine their expertise this year again to propose the Advanced Packaging & System Integration Technology Symposium in Shanghai, prior to Nepcon China.”