AUSTIN, TX – While Apple remains the main customer for TSMC’s integrated fan-out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on substrate, says TechSearch International.

HiSilicon has been in production with ASE’s FOCoS for several years, and MediaTek announced a logic device for networking applications using TSMC’s InFO on substrate (InFO_oS).

TSMC’s FO-WLP platform has been extended to mobile 5G. A multi-stacking technology (MUST) for 3D stacking based on InFO has been introduced for a baseband processor and a memory die. TSMC’s InFO antenna in package (InFO_AIP) targets an RF frontend module (FEM) for mmWave applications.

Several companies and research organizations have reported progress on developing large area process or panel fan-out wafer level packages (FO-WLPs), says TechSearch. ASE and Deca Technologies are cooperating to produce a panel version of the M-series FO-WLP. Nepes has developed a 600mm x 600mm FO-WLP panel process using a liquid crystal display (LCD) production line with a fingerprint sensor as a first product. Powertech Technology’s first product on its panel line will be a PMIC.

Samsung ElectroMechanics (SEMCO) has developed a chip-first panel FO-WLP process that is scheduled for introduction this year. Unimicron has established a pilot production line for panel RDL based on a glass substrate.

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