AUSTIN, TX – A variety of alternatives are challenging silicon’s role in advanced packaging interposers for high-performance applications, says TechSearch International.

This year will see expansion into applications, including networking systems and artificial intelligence applications. Future applications could include servers and data centers, automotive electronics such as Advanced Driver Assistance Systems (ADAS), and virtual reality.

However, shipments are lower than previously expected because lower cost alternatives are emerging. The high cost of silicon interposers with TSVs has driven companies to develop alternatives that do not include the expensive process for TSVs. For example, Xilinx developed the silicon-less interconnect technology (SLIT) solution. Amkor has introduced its version of the technology called silicon interposer-less integrated module (SLIM). Intel’s embedded multi-die interconnect bridge (EMIB) uses a small silicon bridge embedded in an organic substrate, eliminating the need for a large silicon interposer with TSVs.

Several companies are investigating the use of fan-out wafer level package (FOWLP) for data centers and other high-performance applications, according to a new TechSearch report.