AUSTIN, TX -- 3M Electronics Materials launched a new copper-polyimide substrate designed to hold LED chips without adhesive.

In the new design, the LED chip sits directly on top of a large copper conduit area held by a polyimide frame. An alternative to ceramic substrates, the substrate is constructed of copper and polyimide, and is said to meet the electrical and thermal performance required of high-power LED chips. It comes in tray-and-reel format.

“LED chip manufacturers now have an alternative to ceramic substrates,” said Terry Noronha, global business manager, 3M Electronics Materials Solutions Division. "Not only does the 3M substrate meet LED requirements at reduced cost, but it enables reel-to-reel manufacturing with precision engineering – what we believe to be the future of efficient high-volume manufacturing.”

Adhesives are not required to assemble the substrate, allowing use in higher temperatures and avoiding potential thermal barrier or quality control issues. The substrate can be used with wirebond and flip-chip connections.