RESEARCH TRIANGLE PARK, NC – DuPont Circuit & Packaging Materials has been awarded three new US patents related to Kapton black polyimide film and Pyralux black flexible circuit material.

Kapton FPC-MBC black polyimide film is an opaque film that can be used as a substrate or a coverlay.

Pyralux HXC flexible circuit material is the accompanying pre-coated coverlay with an epoxy adhesive coated on one side.

Pyralux LF-B is the acrylic coverlay of matte black polyimide film.

These materials are used in applications such as mobile devices, computers, automotive and military electronics.