WEST HAVEN, CT – A new handbook on organic solderability preservatives discusses how yields, quality and reliability can be increased throughout the supply chain.

The Organic Solderability Preservatives Performance Guide details test results on wave soldering hole fill performance, visual appearance after multiple Pb-free reflows, ICT reliability and ball shear strength.

The guide, authored by Enthone, also provides data comparing the company's novel Entek OSP process with other OSPs.