SAN MATEO, CA -- San Francisco Circuits now offers 20 micron circuit geometries and 30 micron laser vias as part of its push to improve its technology acumen.

The printed circuit board fabricator can now build boards requiring 125 micron bump pitches, 2% impedance tolerancing and gold wire-bonding as well, the company said in a press release.

“We are now positioned to provide our customers with real microcircuit solutions -- HDI fabrication, semiconductor packages, high-speed digital processing, tight geometry interposer and micro medical devices," said Alex Danovich, president of San Francisco Circuits.