HAVERHILL, MA – DKN Research now carries ultra thin copper-free flexible circuits with reliable via holes. The firm developed a series of processing technologies to generate thin nickel traces on both sides of thin polyimide film specifically targeting those scientific and medical applications that require the elimination of copper metals from electronic devices.

It also provides a wider range of design flexibilities for packaging and termination in electronic circuits.

DKN Research partnered with Pyramid Technical Consultants to co-develop copper-free flexible circuits, combining technologies such as sputtering, plating, chemical etching and laser abrasion and drilling. 

The team recently announced the success in establishing a new manufacturing process to generate ultra thin nickel traces down to 0.2µm thick on both sides of thin polyimide film with small via hole connections down to 80µm diameters.

A polyimide etching process and laser drilling process were employed to generate tiny holes on thin polyimide films. A new electroless nickel plating process was developed to make uniform conductive layers on the surface and inside the polyimide film holes. A set of chemical etching processes and laser abrasion processes were furnished to make fine traces down to 50µm line and space. The small via holes formed by this new process are reportedly very reliable, and remained intact during the heat cycle and flexing endurance tests.     

DKN Research is an engineering firm specializing in microelectronics and packaging technology.

Pyramid Technical Consultants is an electronic module manufacturer.