LEOBEN, AUSTRIA -- Multi-Fineline Electronix and AT&S today announced an agreement to share their respective printed circuit board technologies.

Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology.

Financial terms were not disclosed.

Both companies will also continue to pursue market opportunities in their core businesses.

"As global technology leaders, AT&S and MFLEX are leveraging the strengths of each company to jointly manufacture best-in-class HDI rigid-flex printed circuits with assembly capabilities to meet the market needs for complex interconnect solutions," said MFLEX CEO Reza Meshgin.

Initial production of HDI rigid-flex printed circuits has commenced, he added.

Both companies rank in the top 25 in revenues among all board fabricators, according to the annual NTI 100 published by PCD&F.

Follow us on Twitter: @mikebuetow