CHICAGO -- The Chicagoland Circuit Board Association next week will host a pair of talks on pad cratering and HDI options and technologies.
On Dec. 13, Dieter Bergman, the longtime technical director at IPC, will discuss test methods for characterizing PCB assembly pad cratering. Also, Jim Ryan, vice president of business development at Integral Technology, will present an overview of HDI types and novel material solutions for pad cratering.