ARUNDEL, UK -- An upcoming SMART Group workshop will look at benefits and disadvantages of ENIG, OSP, immersion silver, tin and solder leveling as finish options for printed circuit boards.

The Nov. 23 session will review performance during PCB fabrication and assembly, plus some of the common process problems. The impact on long term storage of PCBs also will be discussed. The workshop will include a tour of the Merlin/Artetch circuit board factory.

The workshop will be held Nov. 23 in Arundel. For more information: smartgroup.org/images/stories/finishesworkshop2010.pdf.