ALEXANDRIA, VA -- Six inventors have been issued a US patent for a multilayer electronically isolated thermal conduction structure for a circuit board assembly.

US Patent no. 7,808,788 was issued Oct. 5 to co-inventors Kevin Gertiser, Jim Spall, Karl Schten, Ronald Shearer, Richard Ripple and Michael Lowry, all of Delphi Technologies.

According to the US PTO abstract, the invention covers "a thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers."

The application was filed June 29, 2007, and the document is available at: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=10&f=G&l=50&co1=AND&d=PTXT&s1=20101005.PD.&s2=(IN.INST.)&OS=ISD/10/05/2010+AND+IS/IN&RS=ISD/10/05/2010+AND+IS/IN.