BANNOCKBURN, IL — IPC last week presented scores of awards to individuals who made significant contributions to standards and programs development.

• Printed Board Handling and Storage Guidelines: Tom Kemp, Rockwell Collins and Don Dupriest, Lockheed Martin, for  leadership, and Bev Christian, Research in Motion; Michael Gay, Isola; Dave Hillman, Rockwell Collins; Joe Kane, BAE Systems; Robert Lazzara, Circuit Connect; Sam Theabo, Plexus; Ashley Collier and Chris Goodall, Celestica; Harold Kleinfeldt, RadiSys.
• IPC Bare Board Cleanliness Assessment Task Group that developed IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards: Doug Pauls, Rockwell andHank Sanftleben, Delphi Electronics and Safety, for leadership, and Doug Boyd, John Rohlfling and Bob Clawson, Delphi Electronics and Safety; Bev Christian, RIM; John Radman, Trace Laboratories – Denver; Dewey Whittaker, Honeywell; Fritz Byle, Astronautics Corp.; and Glenn Colescott, ICAPE – USA.
• IPC Power Conversion Devices Standard Subcommittee that developed IPC-9592A, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries: Jerry Strunk, Lineage Power and Neil Witkowski, Alcatel-Lucent, for leadership, and Don Gerstle, Murata Power Solutions; Michael Erni, Dell; T. Paul Parker, SolarBridge Technologies; Gary Gong, Cisco; Anders Petersson, Ericsson Power Module; Eric Swenson, IBM; Bill Tian, Google; Rudolph Wegener, Hewlett-Packard.
• IPC-A-600 Technical Training Task Group that developed the IPC-A-600H Training Program: Leo Lambert, EPTAC and Debora Obitz, Trace Laboratories – East, for leadership, and Todd Henninger, DDi Corp.; Renee Michalkiewicz, Trace; Patricia Scott, Frank Honyotski and Jessica Rheaume, STI; and Russell Shepherd, Microtek Laboratories.
• IPC Flexible Circuits Test Methods Subcommittee that developed IPC TM-650, Method 2.6.21A, Service Temperature of Flexible Printed Wiring: Rocky Hilburn, Insulectro and Duane Mahnke, DBMahnke Consulting, for leadership, and Sidney Cox, DuPont; Brent Sweitzer, Multek Flexible Circuits; Clark Webster, ALL Flex LLC; Thomas Gardeski, Gemini Sciences.
• IPC-2221/2222 Task Group that developed IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards: Cliff Maddox, Boeing and Gary Ferrari, FTG Circuits, for their leadership. For their valuable contributions: Lance Auer and Joe Schmidt, Raytheon; Don Dupriest and Mike Green, Lockheed Martin; Tom Kemp, Rockwell; Phil Henault and Mike Luke, Raytheon; Lionel Fullwood, WKK Distribution.IPC Land Pattern Subcommittee that developed IPC-7351B, Generic Requirements for Surface Mount Design and Land Pattern Standard: Karen McConnell, Northrop Grumman and Gary Ferrari, FTG Circuits, for leadership, and Tom Hausherr, Mentor Graphics and Jack Olson, Caterpillar.