BANNOCKBURN, IL -- IPC today released the first industry-consensus guidelines on handling, packaging and storing printed wiring boards.

IPC-1601, Printed Board Handling and Storage Guidelines, details how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake. The document covers all phases of production, from the manufacture of the bare printed board, through delivery, receiving, stocking, and soldering.

The new document, which some in the industry have been calling for for nearly 20 years, provides guidance on recommended moisture levels and baking profiles for moisture removal, and covers the impact of baking on printed circuit board solderability. The guideline highlights the effects of baking on a number of final finishes, including SnPb, immersion tin, immersion silver, ENIG, ENEPIG and electrolytic gold.

Joseph Kane, senior principal process engineer for BAE Systems Platform Solutions, has done extensive studies on the amount of moisture that can be present in boards. “One intention of IPC-1601 is to keep costs in check," he says. "We don’t want compliance to cost suppliers a lot of money.

“It’s not just the cost; baking causes oxidation and makes the boards harder to solder.”