SCHRAMBERG, GERMANY -- Schweizer Electronic has filed for a patent for producing an embedded component multilayer circuit board.

According to the application, the printed circuit board fabricator seeks a patent on a process describing a "multilayer PCB comprising a stack of a plurality of electrically insulating and/or electro-conductive layers and at least one passive or active electrical component arranged inside the stack of layers. The invention also relates to a passive or active electrical component mounted on said stack, to an associated wiring and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, said insert being surrounded by a resin materials that is liquefied by compression or lamination of the structure."

The application was filed in December 2007, and has an international classification number H05K 1/18.