ENDICOTT, NY -- Endicott Interconnect Technologies on Dec. 15 announced two new major federal electronics packaging contracts worth a total of nearly $106 million.

The US Department of Defense programs included a $50.3 million contract modification to produce card frame assemblies for a high-reliability, high-performance computing application, and a $15.8 million contract modification for spares in support of program sustainment.

The latest installment brings the total award value in excess of $432 million.

The company also announced a $39.5 million research and development contract modification from the US DoD for phase 2 development of electronic spackaging technologies including printed circuit boards and organic substrates for a next-generation supercomputer application.  

EI said the programs would save or create 65 jobs.

The company said the contracts were made possible by a special security clearance designation Rep. Maurice Hinchey (D-NY) helped the company obtain last year. That clearance made EI eligible to work on high security level projects for the DoD and other government agencies and led to the company being eligible for the contracts that were announced Monday.