BANNOCKBURN, IL - The IPC announced a new initiative with Tsinghua University in Beijing to develop a skills development program for electronics assembly.

The program will be based on IPC-A-610, Acceptability of Electronic Assemblies, IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC7711/7721, Rework, Modification and Repair of Electronic Assemblies, and will be offered at approximately 500 vocational schools throughout China.

"The IPC appreciates the opportunity to work with the most prestigious university in China in preparing tomorrow’s workforce,” said David Bergman, IPC VP of international relations. “Through the reach of Tsinghua University, we hope to spread the knowledge of the IPC to 5,000 students annually, educating them on soldering and printed board assembly quality inspection and promoting standards in advanced electronics manufacturing technology.”

The skills development program is expected to start later this year.