ROGERS, Conn.- Rogers Corporation announced the company has licensed a highly compliant thermal interface material technology from International Business Machines (IBM). This technology is used in high performance and high reliability chip packaging applications where heat management becomes a limiting factor. Rogers plans to integrate this product line into its Thermal Management Solutions family of products.


Robert C. Daigle, Rogers Vice President of R&D and Chief Technology Officer, stated, "We are pleased to add this technology to our thermal management portfolio. Products based on this technology will become an essential part of Rogers's strategy of being a solutions provider for our thermal management customers. While searching for thermal interface material technologies, it became clear that IBM had developed a truly unique, high performance material set and we feel confident we can turn this into a commercial success."