SAN JOSE, Calif. - Tessera Technologies announces the release of a new wafer-level camera technology that has been designed to significantly advance the integration of miniaturized cameras into mobile  phones, personal computers, security cameras, and other electronics.

Tessera's  OptiML WLC technology makes it possible for cameras to be manufactured at the wafer level, drastically reducing the size and total bill of material cost of  camera modules. As a result of these and other significant benefits, Tessera is  providing the electronics industry a powerful tool for integrating cameras into  a wider range of electronic products.

Tessera's solution is designed to overcome the cost, size and manufacturing  roadblocks facing the industry as cameras become pervasive in mobile phones and  other electronics. Using OptiML WLC technology, thousands of lenses are  manufactured simultaneously on a wafer, and then bonded at the wafer level to create the optical element of the camera.

The result is simplified assembly and up to 30% cost savings for the optical component of the camera module. OptiML  WLC technology also reduces the size of the camera to a minimum, delivering up  to 50% size reductions over conventional camera modules in camera phones today. 

Tessera's recently acquired Eyesquad technology can be easily integrated into  the OptiML WLC solution, providing advanced auto-focus and digital optical zoom  without the use of moving parts, resulting in greatly enhanced camera  functionally and reliability at lower costs and smaller form factors.