SEOUL – Doosan Corp. has launched mass production at its new flexible copper-clad laminate (FCCL) plant in Gimje, North Jeolla Province, targeting the fast-growing foldable smartphone and wearable device segments. The facility, completed last September, reached full-scale operations in May.

The new production line complements Doosan’s ongoing copper-clad laminate business, which supports AI accelerators for customers like Nvidia. With quality tests underway for AI chips from Marvell and Amazon, Doosan is expected to secure additional CCL contracts later this year. Under CEO Yoo Seung-woo, appointed earlier this year, the company is investing 96 billion won through 2027 to expand its CCL production lines.