TOKYO – Japanese chip materials maker Resonac plans to set up a research and development center for advanced semiconductor packaging and materials in Silicon Valley.

Resonac, formerly Showa Denko, is a manufacturer of packaging materials for PCBs, and plans to begin operations at its new center in 2025.

The packaging stage of production is increasingly being seen as critical for driving advances in chip technology, with the US this week kicking off a $3 billion program to boost its packaging capabilities. Japanese chip sector firms are seeking deeper ties with the US, with foundry venture Rapidus planning to open a sales office there by the end of the current financial year.