SHENZHEN – JLC Technology Group has filed for an IPO with the Shenzhen Stock Exchange, with plans to raise RMB6.67 billion ($911 million).

If the IPO is successful, the company plans to invest RMB2 billion ($273 million) to build a multi-layer PCB production line, as well as RMB1.55 billion ($211 million) into an intelligent PCBA production line.

Founded in 2006, JLC focuses on printed circuit board prototyping/small batch, SMT placement, laser stencil, 3-D printing and other fields for the global electronics industry.