ROUND ROCK, TX -- Following the successful completion of its Spring member meeting, held in Santa Rosa, CA, in February, the High Density Packaging User Group has launched three new projects:

• Large Footprint BGA Warpage – PCB warpage is a common phenomenon due to material CTE mismatch, copper distribution, PCB processes, etc. For large BGA footprints (e.g., >75mm square), extra warpage on the PCB surface and package warpage have been creating significant challenges to SMT (solder joint issues) due to the flatness mismatch between the PCB surface and package. This project focuses on flatness within the BGA footprint that is impacting assembly with the aim of defining a sustainable and achievable BGA flatness guideline.
• Permittivity of Cooling Liquids – It is well known that immersion cooling liquids are used to cool infrastructure equipment to improve thermal reliability and energy efficiency. What is not well understood is the permittivity properties of these liquids. What needs to be addressed is accurate modeling to predict the electrical performance of high-speed busses when these are immersed in a cooling liquid as opposed to air, and is the focus of this project.
• Sequential Lamination – In thicker PCBs and higher layer counts built with sequential lamination, some issues have been associated with this technology, such as resin cracks, delamination, resin voids, and failed microvia connections. The possible goals suggested so far includes: determining how best to test for the ability of the materials to withstand multiple laminations; testing specific laminates for the ability to withstand multiple laminations cycles; defining the critical material factors for a material to be compatible with multiple laminations; develop a standard test board and test methods to evaluate materials in multiple laminations; determine the limit as to how many laminations are possible for a given material; and, define the criteria of what “good” performance is versus “bad” performance relative to the material is when used in multiple laminations.

HDP is a global research and development organization based in Round Rock, TX, dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly.

Nonmembers are welcome to participate during the definition of these projects to understand and help set the scope of the projects. For more information, contact HDP at This email address is being protected from spambots. You need JavaScript enabled to view it..

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