INCHEON, SOUTH KOREA – BH will take over manufacturing more than 50% of iPhone rigid-flex PCBs, according to reports.

Samsung Electro-Mechanics will produce an additional 30%, while Youngpoong Electronics will make another 10%. Samsung plans to exit altogether by November, say reports. The iPhone 13 will most likely be the final one using Samsung’s boards. Other PCB makers may fill the gap left behind when Samsung exits.

Apple is expected to announce the iPhone 13 lineup this September.