RIYADH, SAUDI ARABIA – Sabic intends to boost production capacity for its proprietary resin to support rapid growth of high-performance PCBs used in 5G base stations and high-speed servers.

This latest expansion is expected to nearly double regional production in Asia and increase overall production of the company’s Noryl SA9000 resin in Asia tenfold vs. 2018 levels. The expansion project is currently underway in India, with completion expected by the end of 2020.

The gain in capacity will help reduce global lead times for manufacturers of high-performance copper-clad laminates. The resin is used in copper-clad laminates for PCBs for the 5G infrastructure market, which is forecast to register a 53% CAGR between 2020 and 2025, according to Mordor Intelligence.

“Sabic continues to invest in specialized materials that help advance global adoption of 5G networking,” said Scott Fisher, business director, Specialties, Sabic. “As the wireless networking industry faces rising demand for infrastructure with high expectations for speed, bandwidth and low latency, Sabic is committed to delivering the unique material solutions our customers need to help drive this technology forward.”

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