SANTA CLARA, CA – Intel shared a new method for making transistors on semiconductors that could boost processor performance by up to 20%, its chief architect said.

The announcement is a rebuke to reports last month that Intel’s move to a 7nm chipmaking process node would be delayed. Today Intel said it has a new way of making SuperFin transistors with a new material, boosting the performance of forthcoming processors, despite still being made on 10nm manufacturing lines.

"It is 20%, the largest intra-node jump ever in our history," said Raja Koduri, Intel's chief architect. "It's actually the same as what you would get with one full Moore's Law node of performance."

The Tiger Lake laptop chips set to be released in fall will use the chips, according to reports.

"Whatever gets us to deliver those products on time, with leadership performance, we have the flexibility and are going to utilize that.”

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